¹øÈ£
±¸ ºÐ
¿ë ¾î
³¯ Â¥
17
µµÃ¼ °£°Ý (Conductor spacing)
2006-03-14
16
µµ±Ý( Plating)
2006-03-14
15
µµ±Ý ÀüÂø¼º(Throwing Power)
2006-03-14
14
µµ±Ý ¹× ¿ÜÃþ¹è¼±ÀÇ Çü¼º
2006-03-14
13
µ§Æ® (Dent)
2006-03-14
12
´Ü¸é Àμâȸ·Î±âÆÇ(Single -Side Printed Circuit Board)
2006-03-14
11
´ÙÃþ Àμâ ȸ·Î ±âÆÇ(Multilayer Printed Circuit Board)
2006-03-14
10
³×ÀÏÇìµå( Nail heading)
2006-03-14
9
³×°¡Æ¼ºê(Negative)
2006-03-14
8
³»Ãþ¹è¼±ÀÇ Çü¼º
2006-03-14
7
³³¶«¸é(Solder Side)
2006-03-14
6
±Û·ÎÀ× (Glowing)
2006-03-14
5
±×·Î¿ìÀ×(Glowing)
2006-03-14
4
±¸¸Û¿¡ ÀÇÇÑ ·£µå ²÷¾îÁü (Hole breakout)
2006-03-14
3
°á°¢(Indentation)
2006-03-14
2
°ÝÀÚ(Grid)
2006-03-14
1
°ÖÁ¡(Gel point)
2006-03-14