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157
Activation
2006-03-14
156
Acid Gold Plating
2006-03-14
155
ACF(Anisotropic Conductive Film)
2006-03-14
154
Acetyl
2006-03-14
153
Access Holes
2006-03-14
152
Acception Tests(½ÂÀνÃÇè)
2006-03-14
151
A.Q.L(ÇÕ°ÝÇ°Áú ¼öÁØ)
2006-03-14
150
ÈÚ(Bow)
2006-03-14
149
ÈÚ (Warp)
2006-03-14
148
ÈÄ·º½º-¸®Áþµå ¹è¼±ÆÇ(Flex-rigid Printed Circuit Board)
2006-03-14
147
ÈÄ·¹À̹Ö(Flaming)
2006-03-14
146
ÈÄ·¯½¬ µµÃ¼(Flush Conductor)
2006-03-14
145
Ȧ Æí½É(Hole breakout)
2006-03-14
144
Ȧ ¸Å¸³¹ý
2006-03-14
143
ÇÖ¿¡¾î ·¹º§¸µ( Hot air Levelling)
2006-03-14
142
ÇÒ·ÎÀ× (Haloing)
2006-03-14
141
ÇÏ·ÎÀ×(Haloing)
2006-03-14
140
ÇÍÆ® (Pit)
2006-03-14
139
ÇÉ È¦(Pin hole)
2006-03-14
138
Ç÷º½Ãºí ¹è¼±ÆÇ(Flexible Printed Circuit Board)
2006-03-14